SPD FILMS FORMED WITH CONDUCTIVE POLYMER-COATED SUBSTRATES
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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N/A
Issued Date -
Sep 20, 2012
app pub date -
May 4, 2012
filing date -
May 4, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Importance

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Abstract
A suspended particle device (SPD) film or laminate thereof. The film includes substrates coated on their inner surface with a polythiophene-based conductive polymer serving as electrode means. The polymer may be applied in the form of an aqueous composition also comprising solvent(s) and binder(s). A preferred polymer is a polyethylene dioxythiophene (PEDT) polymer. The polymer may be doped with polystyrene sulfonate. The polymer may be connected to a conductive material that extends beyond an outer boundary of the film to connect with a voltage source. Adhesive strength between the cured emulsion and the polymer is at least 1.46 N/25 mm. A further aspect constitutes a method for increasing adhesion between a cured suspended particle device emulsion and electrode means in a light valve film. The method comprises applying the polymer on an inner surface of the substrates constituting the film to serve as the electrode means.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
RESEARCH FRONTIERS INCORPORATED | 240 CROSSWAYS PARK DRIVE WOODBURY NY 11797 |
International Classification(s)

- 2012 Application Filing Year
- B05D Class
- 2126 Applications Filed
- 979 Patents Issued To-Date
- 46.05 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Chen, Xiao-Ping | East Meadow, US | 14 | 85 |
# of filed Patents : 14 Total Citations : 85 | |||
Hull, William J | Bayside, US | 3 | 43 |
# of filed Patents : 3 Total Citations : 43 | |||
Slovak, Steven M | N. Massapequa, US | 24 | 376 |
# of filed Patents : 24 Total Citations : 376 | |||
Wang, Dongyan | Ithaca, US | 61 | 2521 |
# of filed Patents : 61 Total Citations : 2521 |
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Patent Citation Ranking
- 5 Citation Count
- B05D Class
- 8.98 % this patent is cited more than
- 13 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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