LASER SCRIBING WITH EXTENDED DEPTH AFFECTATION INTO A WORKPLACE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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N/A
Issued Date -
N/A
app pub date -
Mar 16, 2012
filing date -
Dec 7, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Systems and methods for laser scribing provide extended depth affectation into a substrate or workpiece by focusing a laser beam such that the beam passes into the workpiece using a waveguide, self-focusing effect to cause internal crystal damage along a channel extending into the workpiece. Different optical effects may be used to facilitate the waveguide, self-focusing effect, such as multi-photon absorption in the material of the workpiece, transparency of the material of the workpiece, and aberrations of the focused laser. The laser beam may have a wavelength, pulse duration, and pulse energy, for example, to provide transmission through the material and multi-photon absorption in the material. An aberrated, focused laser beam may also be used to provide a longitudinal spherical aberration range sufficient to extend the effective depth of field (DOF) into the workpiece.
First Claim
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