SOLDERING PROCESS USING ELECTRODEPOSITED INDIUM AND/OR GALLIUM, AND ARTICLE COMPRISING AN INTERMEDIATE LAYER WITH INDIUM AND/OR GALLIUM

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Issued Date
Sep 20, 2012
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Sep 8, 2010
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Sep 8, 2009

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Abstract

The present invention relates to a low temperature process for producing and joining metal substrates using an intermediate layer comprising indium or gallium, wherein the indium or gallium layer is formed by electrodeposition from an ionic liquid comprising an indium or gallium salt.

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Patent Owner	Address
ASTRON ADVANCED MATERIALS LIMITED	2 NEWLANDS WAY BROADSTONE DORSET BH18 9JH

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Inventor Name	Address	# of filed Patents	Total Citations
Seddon, Kenneth	Belfast, GB	7	15
Srinivasen, Geetha	Belfast, GB	2	7
Wilson, Anthony	Broadstone, GB	20	422

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SOLDERING PROCESS USING ELECTRODEPOSITED INDIUM AND/OR GALLIUM, AND ARTICLE COMPRISING AN INTERMEDIATE LAYER WITH INDIUM AND/OR GALLIUM

Number of patents in Portfolio can not be more than 2000

United States of America Patent

13394683

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13394683

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