ELECTRONIC COMPONENT MOUNTING APPARATUS
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United States of America Patent
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Issued Date -
Sep 20, 2012
app pub date -
Mar 16, 2012
filing date -
Mar 17, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An electronic component mounting apparatus in which an electronic component may be checked to provide highly accurate and efficient electronic component mounting. The apparatus includes a camera unit fixed on a head support and images an electronic component absorbed or to be absorbed onto a nozzle. The camera unit contains a camera module including a camera obtaining an image, a first lighting section disposed adjacently on a side of the camera closer to the nozzle and emitting light toward an imaging region of the camera, a second lighting section disposed adjacently on a side of the camera farther from the nozzle and emitting light toward the imaging region of the camera, and a baffle; and a bracket fixed on the head support and supporting the camera, the first lighting section, the second lighting section and the baffle.
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