DEFECTIVE CONDUCTIVE SURFACE PAD REPAIR FOR MICROELECTRONIC CIRCUIT CARDS
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United States of America Patent
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app pub date -
Mar 7, 2011
filing date -
Mar 7, 2011
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Abandoned
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Abstract
An electrically conductive adhesive (ECA) for repairing electrically conductive pad and trace interconnects and a method of repairing interconnect locations. The method of repairing at least one defect within the area of electrically conductive circuitized substrate traces and pads outside of a pristine center area incorporates an ECA and a forming gas plasma. The ECA contains a mixture of components that allow the adhesive to be adapted to specific requirements. Curing the adhesive results in effective electrical connections being formed between the adhesive and the base pad so that the metallurgies of the conductors and of the ECA are effectively combined to engage and repair the conductor defect.
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