INTERCONNECTED HEAT PIPE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20120227935A1
SERIAL NO

13045737

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to an interconnected heat pipe assembly and a method for manufacturing the same. The interconnected heat pipe assembly includes a first heat pipe and a second heat pipe. The first heat pipe comprises a first pipe, a first wick structure and a first working fluid. The first pipe has a hollow chamber and an opening. The first wick structure is arranged on inner walls of the hollow chamber. The first working fluid is filled in the hollow chamber. The second heat pipe is disposed through the opening in the first pipe with a portion of the second heat pipe being received in the hollow chamber. An air channel is formed between outer walls of the second heat pipe and inner walls of the first pipe. The present invention can conduct heat to a long distance and has an increased heat-conducting efficiency.

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Patent Owner(s)

Patent OwnerAddress
KUNSHAN JUE-CHUNG ELECTRONICS CO LTDNO 7 SHUANGHE RD DIANSHANHU KUNSHAN CITY JIANGSU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HUANG, Yu-Po Kunshan City, CN 15 93

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