SOLDERING METHOD, GYROSCOPE AND SOLDERED PART
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United States of America Patent
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Issued Date -
Sep 13, 2012
app pub date -
Nov 10, 2010
filing date -
Nov 12, 2009
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Abandoned
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Abstract
The invention relates to a method of soldering a conducting body to a substrate using an alloy chosen from either a tin-silver alloy or a tin-silver-copper alloy. The method comprises metallization of the substrate by depositing a tie layer on the substrate, depositing a diffusion barrier layer, or depositing a wetting layer comprising gold. The tie layer having any one of the chemical components chosen from chromium, titanium or titanium alloy. The diffusion barrier layer comprising a material chosen from platinum or palladium.
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