SOLDER BATH AND METHOD OF HEATING SOLDER CONTAINED IN THE SOLDER BATH
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United States of America Patent
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N/A
Issued Date -
N/A
app pub date -
Apr 2, 2012
filing date -
Dec 27, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A solder bath comprises a solder bath main body containing lead-free solder. A heating member heats the solder and is mounted on outer surfaces of a bottom and sides of the solder bath main body. The heating member contains a thermal diffusion member that is made of stainless steel, a porous heat insulator that is mounted on and attached to the thermal diffusion member, and a heating element that is buried in the porous heat insulator. The heating element is also away from the thermal diffusion member. The thermal diffusion member is heated by heat of the heating element to heat the solder bath main body evenly through thermal diffusion from the thermal diffusion member up to a constant range of temperature and the solder contained in the solder bath is heated evenly to a constant range of temperature.
First Claim
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Family
| Country | kind | publication No. | Filing Date |
|---|---|---|---|
| JP | A | JP2010155269 | Dec 27, 2008 |
| US | A1 | US20100163600 | Dec 23, 2009 |
| EP | B1 | EP2202022 | Dec 23, 2009 |
| CN | A | CN101767239 | Dec 28, 2009 |
International Classification(s)
- 2012 Application Filing Year
- F24H Class
- 223 Applications Filed
- 178 Patents Issued To-Date
- 79.83 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- F24H Class
- 0 % this patent is cited more than
- 13 Age