HEAT RESISTANT PLA-ABS COMPOSITIONS
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United States of America Patent
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Issued Date -
Aug 30, 2012
app pub date -
Oct 27, 2010
filing date -
Oct 30, 2009
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Abandoned
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Abstract
A significant disadvantage of the use of polylactic acid (PLA) has been overcome by the use of acrylonitrile-butadiene-styrene (ABS) in combination with an epoxy functional styrene-acrylate oligomeric chain extender. The composition also often exceeds a threshold of 65° C. in heat deflection temperature. Use of an impact modifier further improves the industrial versatility of the heat resistant PLA composition.
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