Bonded Semiconductor Structure With Pyramid-Shaped Alignment Openings and Projections
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United States of America Patent
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Issued Date -
Aug 30, 2012
app pub date -
Feb 28, 2011
filing date -
Feb 28, 2011
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Abstract
A bonded semiconductor structure is formed in a method that first forms a female semiconductor structure with pyramid-shaped openings and a male semiconductor structure with pyramid-shaped projections, and then inserts the projections into the openings to align the male semiconductor structure to the female semiconductor structure for bonding.
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