METHOD AND STRUCTURE FOR ENCAPSULATING SOLID-STATE LIGHT EMITTING CHIP AND LIGHT SOURCES USING THE ENCAPSULATION STRUCTURE
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United States of America Patent
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Issued Date -
Aug 30, 2012
app pub date -
Nov 19, 2010
filing date -
Nov 19, 2009
priority date (Note) -
Abandoned
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Abstract
A structure and a method for encapsulating a solid-state lighting chip (1) are provided. The structure includes the following parts: a heat sink base (2) is provided; a single solid-state lighting chip (1) or multiple solid-state lighting chips distributed as an array are positioned or packaged on the heat sink base (2); the lighting surface of the solid-state lighting chip (1) is set as a bare surface; a single alignment unit (5) or multiple alignment units distributed as an array are positioned above the solid-state lighting chip (1) and aligned with the solid-state lighting chip (1), in order to output a nearly parallel light which is aligned from the light of the solid-state lighting chip (1). A light source device or a lamp device with the light source device using the encapsulating structure or the method, has the advantages of low levels of light expansion, and high brightness, high power light output with low cost.
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