SOLDERING JIG
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United States of America Patent
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Issued Date -
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app pub date -
May 10, 2012
filing date -
Nov 10, 2009
priority date (Note) -
Abandoned
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Abstract
A soldering jig is disclosed. The soldering jig in accordance with an embodiment of the present invention includes: a mounting block having a plurality of accommodation holes penetrating from one surface to the other surface thereof, a plurality of soldered objects being accommodated in the plurality of accommodation holes; a first cover block coupled to one surface of the mounting block and having a support part configured to support the plurality of soldered objects accommodated in the plurality of accommodation holes; and a second cover block coupled to the other surface of the mounting block and having a plurality of pressing protrusions protruded to face the plurality of accommodation holes, respectively, to elastically support the plurality of soldered objects. Accordingly, a Gunn diode package that is soldered in a uniform quality can be obtained by maintaining a uniform pressure and heat transfer to the soldered objects in a soldering process.
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