INTEGRATED BACKLIGHT MODULE WITH GOOD HEAT EQUALIZATION AND HEAT DISSIPATION PERFORMANCE
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United States of America Patent
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Issued Date -
Aug 23, 2012
app pub date -
Feb 22, 2011
filing date -
Feb 22, 2011
priority date (Note) -
Abandoned
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Abstract
The present invention relates to an integrated backlight module with good heat equalization and heat dissipation performance, comprising: a main frame, a welded material, a thermal conductive medium, and at least one light source module, wherein the main frame has at least one edge for disposing the light source module and has good heat dissipation property. The light source module comprises: a reflective member, a copper circuit layer and a plurality of LED chips, wherein the light source module attached with a thermal conductive adhesion is attached to the edge of the main frame via the thermal conductive medium; besides, the welded material is used for steadily combining the thermal conductive medium with the edge. Thus, when the plurality of LED chips emit, the heat produced by the LED chips is transferred to the thermal conductive medium through the copper circuit layer and the thermal conductive adhesion, and the thermal conductive medium conducts the heat to the edge of the main frame through a high efficiency thermal conducting way, so that the heat is dissipated via the main frame.
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