Wafer Furnace with Variable Flow Gas Jets
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United States of America Patent
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Issued Date -
Aug 23, 2012
app pub date -
Feb 23, 2011
filing date -
Feb 23, 2011
priority date (Note) -
Abandoned
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Abstract
A method of forming a sheet wafer 1) passes at least two filaments through a molten material to produce a partially formed sheet wafer, 2) directs a cooling fluid at a flow rate toward the partially formed sheet wafer to convectively cool a given portion of the partially formed sheet wafer, and 3) monitors the thickness of the given portion of the partially formed sheet wafer. To ensure appropriate thicknesses of the wafer, the method controls the flow rate of the cooling fluid as a function of the thickness of the given portion of the partially formed sheet wafer.
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