MODULE IC PACKAGE STRUCTURE
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United States of America Patent
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N/A
Issued Date -
Aug 23, 2012
app pub date -
Apr 23, 2011
filing date -
Feb 23, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A module IC package structure includes a substrate unit, a radio frequency unit, an inner shielding unit, an insulative package unit, and an outer shielding unit. The substrate unit includes a circuit substrate. The radio frequency unit includes at least one radio frequency element disposed on and electrically connected to the circuit substrate. The inner shielding unit includes an inner metal shielding layer formed on a predetermined surface of the radio frequency element. The insulative package unit includes an insulative package resin body disposed on the circuit substrate to cover the radio frequency element. The outer shielding unit is formed on the outer surface of the insulative package resin body and electrically connected to the circuit substrate. The inner metal shielding layer is a radio frequency property maintaining layer disposed between the radio frequency element and one part of the outer shielding unit for shielding the radio frequency element.
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