APPARATUS AND METHOD FOR PICKING UP AND MOUNTING BARE DIES

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United States of America Patent

APP PUB NO 20120210554A1
SERIAL NO

13241797

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Provided are an apparatus and method for picking up and mounting parts. The apparatus includes: a first pickup unit including a plurality of first suction nozzles which pick up parts from a first substrate by sucking the parts; a flipper comprising a rotary driving member which rotates the first pickup unit such that a surface of each of the parts sucked by the first suction nozzles faces toward one direction; and a second pickup unit including a plurality of second suction nozzles which pick up the parts sucked by the first suction nozzles of the first pickup unit rotated by the flipper by sucking the parts and mount the picked-up parts on a second substrate.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG TECHWIN CO LTDGYEONGNAM CHANGWON CITY SOUTH KOREA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HAN, Jung-Il Incheon, KR 9 192

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