ENCLOSURE
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United States of America Patent
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Issued Date -
Aug 9, 2012
app pub date -
Jul 2, 2010
filing date -
Jul 2, 2009
priority date (Note) -
Abandoned
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Abstract
An enclosure of an active implantable device comprises a composite material which comprises a first layer of a polyetheretherketone film, a second layer of polyetheretherketone film (8) and, sandwiched between, a third layer comprising titanium. The arrangement may be provided in various embodiments such as comprising housing halves (70,72) and a lid (74), each being made of the three layers described. In one embodiment, a communications window may be provided which has a thinner layer of titanium, to facilitate communications between the outside and electrical components positioned within the enclosure.
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