BSI IMAGE SENSOR PACKAGE WITH VARIABLE LIGHT TRANSMISSION FOR EVEN RECEPTION OF DIFFERENT WAVELENGTHS
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United States of America Patent
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Issued Date -
Aug 9, 2012
app pub date -
Feb 3, 2011
filing date -
Feb 3, 2011
priority date (Note) -
Abandoned
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Abstract
A microelectronic image sensor assembly for backside illumination and method of making same are provided. The assembly includes a microelectronic element having contacts exposed at a front face and light sensing elements arranged to receive light of different wavelengths through a semiconductor region adjacent a rear face. The semiconductor region has a first region of material overlying the first light sensing element and a second region of material overlying the second light sensing element such that the first and second wavelengths are able to pass through the first and second regions, respectively, and reach the first and second light sensing elements with substantially the same intensity.
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