PROCESS FOR FORMING MULTILAYER STRUCTURES CONTAINING A METAL LAYER
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United States of America Patent
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Issued Date -
Aug 2, 2012
app pub date -
Jan 27, 2011
filing date -
Jan 27, 2011
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Abandoned
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Abstract
A process for producing a multilayer structure comprising:
- contacting an adhesive layer having a first side and a second side, on its first side with a metal layer having a first side and a second side, on its first side at a temperature of 325° F. to 425° F. for a contact time of 0.5 to 5.0 seconds, thereby adhering the adhesive layer to the metal layer. The adhesive layer comprises an ethylene-C4-8 α-olefin linear low density copolymer; a polymer grafted with an ethylenically unsaturated carboxylic acid or acid derivative; and a styrene-butadiene-styrene triblock copolymer having an MI of 5 to 50.
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