METHOD FOR ENHANCING METALLIZATION IN SELECTIVE DEPOSITION PROCESSES
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United States of America Patent
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Issued Date -
Aug 2, 2012
app pub date -
Jan 10, 2012
filing date -
Jan 31, 2011
priority date (Note) -
Abandoned
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Abstract
A method for achieving a clean substrate, the method may include depositing a protective material on an area of a substrate, to prevent the area from being contaminated by a coating material that is to be deposited during a deposition process; and removing the protective material from the area after the coating material was cured.
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