GLOB TOP SEMICONDUCTOR PACKAGE
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United States of America Patent
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N/A
Issued Date -
Aug 2, 2012
app pub date -
Feb 1, 2011
filing date -
Feb 1, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A semiconductor package is disclosed including a substrate, a solder mask layer, one or more semiconductor die mounted to the solder mask layer and electrically coupled to the substrate, and a glob top cover over the semiconductor die. The solder mask further includes a dam protruding above surrounding areas of the solder mask layer and a cavity recessed into the solder mask layer for limiting flow of the glob top cover when the glob top material is applied.
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