CUSTOMIZED RF MEMS CAPACITOR ARRAY USING REDISTRIBUTION LAYER
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United States of America Patent
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Issued Date -
Aug 2, 2012
app pub date -
Dec 6, 2011
filing date -
Jan 27, 2011
priority date (Note) -
Abandoned
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Abstract
Disclosed is a method for fabricating a customized micro-electromechanical systems (MEMS) integrated circuit using at least one redistribution layer. The method includes steps of providing a substrate on which MEMS components are fabricated and coupling predetermined ones of the MEMS components via the redistribution traces.
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