STACKED DIE PACKAGES WITH FLIP-CHIP AND WIRE BONDING DIES

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United States of America Patent

APP PUB NO 20120193772A1
SERIAL NO

13016661

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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The present technology discloses a stacked die package. In one embodiment, a package comprises a first die, a second die, and a leadframe. The first die is electrically coupled to the bottom surface of the leadframe through contact bump/bumps. The second die is electrically coupled to the top surface of the leadframe through wirebond/wires. The second die is mounted on the top surface of the first die.

First Claim

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Patent Owner(s)

Patent OwnerAddress
MONOLITHIC POWER SYSTEMS INC79 GREAT OAKS BLVD SAN JOSE CA 95119

International Classification(s)

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  • 2011 Application Filing Year
  • H01L Class
  • 19146 Applications Filed
  • 15997 Patents Issued To-Date
  • 83.56 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20112012201320142015201620172018201920202021202220230255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jiang, Hunt Hang Saratoga, US 32 581

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Patent Citation Ranking

  • 11 Citation Count
  • H01L Class
  • 50.29 % this patent is cited more than
  • 13 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges234326114937383772491639770504017801 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +020040060080010001200140016001800200022002400260028003000320034003600

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