METHOD AND APPARATUS OF COMPRESSION MOLDING TO REDUCE VOIDS IN MOLDING COMPOUNDS OF SEMICONDUCTOR PACKAGES
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United States of America Patent
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Issued Date -
Jul 26, 2012
app pub date -
Aug 22, 2011
filing date -
Jan 20, 2011
priority date (Note) -
Abandoned
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Abstract
Disclosed are a method and an apparatus of compression molding to reduce voids in molding compounds of semiconductor packages. A compression mold jig set including a top mold and a bottom mold is provided and disposed inside a pressure chamber. A substrate disposed with chips is loaded on the top mold. An encapsulating material is filled in the cavity of the bottom mold. When heating the bottom mold to melt the encapsulating material, a positive air pressure more than 1 atm is provided in the pressure chamber in order to expel or reduce any bubbles trapped inside the encapsulating material. Then, the top mold is pressed downward to clamp with the bottom mold under the heating and high-pressure condition until the encapsulating material is pre-cured to transform a molding compound adhered to the substrate. Therefore, potential bubble trapped inside the molding compound can be eliminated or reduced to improve production yield, reliability and life time.
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