Integrated circuit package assembly including wave guide
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United States of America Patent
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Jun 2, 2015
Grant Date -
Jul 26, 2012
app pub date -
Mar 30, 2012
filing date -
Mar 29, 2010
priority date (Note) -
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Abstract
Some embodiments herein relate to a transmitter. The transmitter includes an integrated circuit (IC) package including a first antenna configured to radiate a first electromagnetic signal therefrom. A printed circuit board (PCB) substrate includes a waveguide configured to receive the first electromagnetic signal and to generate a waveguide signal based thereon. A second antenna can be electrically coupled to the waveguide and can radiate a second electromagnetic signal that corresponds to the waveguide signal. Other devices and methods are also disclosed.
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