STRUCTURE OF LIGHT SOURCE MODULE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Jul 26, 2012
app pub date -
Apr 1, 2011
filing date -
Jan 26, 2011
priority date (Note) -
Abandoned
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Abstract
A circuit substrate and at least one light-emitting diode (LED) chip are adhered to a heatsink substrate in sequence, and then a packaging material is formed on the LED chip. The circuit substrate has at least one through hole, and the LED chip is buried in the through hole on the circuit substrate so that the LED chip is in direct contact with the heatsink substrate, so as to reduce the thermal resistance between the LED chip and the heatsink substrate, thus effectively dissipating the heat energy of the LED chip through the heatsink substrate.
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