COOLING MODULE FOR LED LAMP
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United States of America Patent
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Issued Date -
Jul 26, 2012
app pub date -
Jan 26, 2011
filing date -
Jan 26, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A cooling module for an LED lamp includes a thermostatic plate, a hollow column, and a plurality of cooling fins. The thermostatic plate has an evaporating segment and a pair of condensing segments extending from the evaporating segment. The outer surface of the hollow column has a pair of grooves corresponding to each other. The condensing segments of the thermostatic plate are buried in the grooves. The cooling fins surround and thermally contact the outer rim of the hollow column and the condensing segments.
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