CMP POLISHING PAD AND METHOD FOR MANUFACTURING SAME
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United States of America Patent
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Issued Date -
Jul 19, 2012
app pub date -
Apr 30, 2010
filing date -
Jul 30, 2009
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Abandoned
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Abstract
The present invention relates to a CMP polishing pad and to a method for manufacturing same. The CMP polishing pad is manufactured by means of a method in which a light-absorbing material is dispersed in or on the surface of the pad, and a laser beam is absorbed by the light-absorbing material to form holes, wherein the diameter of the holes is determined by the wavelength of the laser beam. The CMP polishing pad of the present invention has holes formed therein by absorbing laser light with light-absorbing material dispersed on the surface of or in the CMP polishing pad, and laser beams of various wavelengths can be effectively absorbed in accordance with the type of light-absorbing material, such that holes having a desired diameter can be formed in the CMP polishing pad, thereby enabling the low-cost manufacture of a CMP polishing pad with excellent polishing characteristics.
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