METHOD FOR SELECTIVELY METALLIZING A SUBSTRATE AND INTERCONNECT DEVICE PRODUCED BY THIS METHOD
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United States of America Patent
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Issued Date -
Jul 19, 2012
app pub date -
Jan 16, 2012
filing date -
Jan 14, 2011
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Abstract
A method for selectively metallizing a substrate having a significant content of a plastics material includes ablating a layer of the substrate close to a surface of the substrate in a region of the substrate to be metallized so as to provide access to an additive having at least one compound from a substance family of aluminosilicates that is incorporated in the plastics material and to open one of a pore or a pore structure of the aluminosilicates in the region of the substrate to be metallized. The substrate is metallized with no external current starting inside the pore or the pore structure so as to incorporate a precious metal in the substrate and then at an outer edge region of the pores so as to form a planar metallization layer on the surface of the substrate
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