THREE-DIMENSIONALLY INTEGRATED SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE INCORPORATION BY REFERENCE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jul 19, 2012
app pub date -
Jan 17, 2012
filing date -
Jan 17, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A three-dimensionally integrated semiconductor device includes a flexible circuit substrate which has a lower portion, an upper portion, and at least one side portion, a support body which supports the upper portion of the flexible circuit substrate, and at least two devices mounted on the flexible circuit substrate and wherein at least one of the devices is mounted on an upper surface of the lower portion of the flexible circuit substrate, at least one of the other devices is mounted on a lower surface of the upper portion of the flexible circuit substrate, and a gap is provided between the device mounted on the upper surface of the lower portion of the flexible circuit substrate and the device mounted on the lower surface of the upper portion of the flexible circuit substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully