VERTICAL PARASITIC PNP DEVICE IN A SILICON-GERMANIUM HBT PROCESS AND MANUFACTURING METHOD OF THE SAME

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United States of America Patent

APP PUB NO 20120181579A1
SERIAL NO

13330458

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Abstract

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A vertical parasitic PNP device in a SiGe HBT process is disclosed which comprises a collector region, a base region, an emitter region, P-type pseudo buried layers and N-type polysilicons. The pseudo buried layers are formed at bottom of shallow trench field oxide regions around the collector region and contact with the collector region; deep hole contacts are formed on top of the pseudo buried layers to pick up collector electrodes. The N-type polysilicons are formed on top of the base region and are used to pick up base electrodes. The emitter region comprises a P-type SiGe epitaxial layer and a P-type polysilicon both of which are formed on top of the base region. A manufacturing method of a vertical parasitic PNP device in a SiGe HBT process is also disclosed.

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Patent Owner(s)

Patent OwnerAddress
SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING CORPORATIONNO 1399 ZU CHONG ZHI ROAD ZHANGJIANG HI-TECH PARK PUDONG NEW AREA SHANGHAI 201203

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Fan Shanghai, CN 114 740
Chen, Xiongbin Shanghai, CN 17 100

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