METHOD OF CUTTING A SUBSTRATE AND A DEVICE FOR CUTTING
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United States of America Patent
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Issued Date -
Jul 19, 2012
app pub date -
Sep 29, 2010
filing date -
Sep 29, 2009
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a method of cutting a substrate by the introduction of thermo-mechanical tensions. The present invention also relates to the precise manufacturing of a substrate shape by the cutting method specified. The present invention also relates to a device for performing the method according to the present invention.
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