HEAT SINK CLIP DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20120181008A1
SERIAL NO

13008593

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A heat sink clip device, configured to secure a heat sink to a heat generating unit, the heat sink clip comprises a thermal conductive board and a plurality of locking members. The thermal conductive board is attached to the heat generating unit. The thermal conductive board may include a plurality of connecting apertures. Each connecting aperture may include a bigger diameter portion and a smaller diameter portion connected with the bigger diameter portion. A plurality of locking members may be engaged with the corresponding connecting aperture. Each locking members may include a threaded member and an elastic unit sheathed on the threaded member. The threaded member may include a bar portion, a head portion and a blocking ring. The head portion and the blocking ring are respectively on both sides of the bar portion. The diameter of the bar portion may be a little bit smaller than the size of the smaller diameter portion. The outside diameter of the blocking ring may be a little bit smaller than the size of the bigger diameter portion. The inside diameter of the elastic unit may be a little bit bigger than the outside diameter of the blocking ring. The bar portion and the blocking ring may go through the bigger diameter portion and then may be secured to the smaller diameter portion. The elastic unit may be suppressed between the threaded member head and the thermal conductive board. This creates a heat sink clip device.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
CHAUN-CHOUNG TECHNOLOGY CORPSANCHUNG CITY TAPEI HSIEN

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LIN, I-Yung Taipei, TW 4 11
Liu, Po-Chih Taipei, TW 7 10

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