CMP POLISHING PAD HAVING PORES FORMED THEREIN, AND METHOD FOR MANUFACTURING SAME
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United States of America Patent
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Issued Date -
Jul 12, 2012
app pub date -
Apr 30, 2010
filing date -
Jul 30, 2009
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Abandoned
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Abstract
The present invention relates to a CMP polishing pad and to a method for manufacturing same, characterized in that a light-absorbing material for forming pores is dispersed in the pad. Pores formed in the CMP polishing pad of the present invention are formed by means of the breakdown of the light-absorbing material which absorbs a laser beam irradiated on the polishing pad, enabling the pore size to be controlled by controlling the amount of the light-absorbing material, the intensity of the laser beam, etc., and enabling pore distribution to be freely controlled through the computer numerical control (CNC) technique. Accordingly, a CMP polishing pad can be provided that exhibits the highest polishing effectiveness in accordance with the material to be polished or the type of slurry.
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