SENSOR MODULE
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United States of America Patent
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-
N/A
Issued Date -
Jul 12, 2012
app pub date -
Jul 22, 2011
filing date -
Jan 11, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A sensor module includes a lens attached on an opening side of a housing and a circuit board with a sensor device mounted thereon attached on the other opening side. A stepped part is formed on the inside of the housing. An adjustment gap for adjusting the position of the circuit board is formed between a vertical face of this stepped part and an outer peripheral face of the circuit board. An adhesive injection groove that varies the width of the adjustment gap is formed by providing a recess and/or a projection on the vertical face of the stepped part and an opposing face of the outer peripheral face of the circuit board in at least one of at least two fixing portions where the circuit board is fixed to the stepped part with an adhesive. Adhesive is applied into the adhesive injection groove.
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