METHOD OF SEALING AN ELECTRONIC DEVICE

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United States of America Patent

APP PUB NO 20120171800A1
SERIAL NO

12982249

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of sealing an electronic device is disclosed, comprising providing an assembly comprising first and second substrates in an opposed relationship, and an electronic device positioned between the first and second substrates; positioning a glass rod against or on the edge of the first and/or second substrate; and heating and softening the glass rod to form a hermetic seal between the first and second substrates and form a hermetically sealed electronic device.

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Patent Owner(s)

Patent OwnerAddress
DU PONT APOLLO LTDUNITS 501-509 5/F WEST WING OF LAKESIDE 1 NO 8 SCIENCE PARK WEST AVENUE HONG KONG SCIENCE PARK PAK SHEK KOK NEW TERRITORIES

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chan, Chung-Pui Hong Kong, HK 5 2
Cheng, Stephen Yau Sang Hong Kong, HK 5 2
Yip, Chui-Ling Hong Kong, HK 4 5

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges8981322593492317814721101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050100150200250300350400450500550600650700750800850900

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