DISPLACEMENT GOLD PLATING SOLUTION AND METHOD FOR FORMING CONNECTING PORTION
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jul 5, 2012
app pub date -
Apr 15, 2011
filing date -
Aug 27, 2010
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention provides a displacement gold plating solution and a plating treatment technology capable of realizing a uniform film thickness when forming a connecting portion obtained by sequentially plating a nickel layer, a palladium layer, and a gold layer in layers. The present invention provides a displacement gold plating solution for forming a connecting portion obtained by sequentially plating a nickel layer, a palladium layer, and a gold layer in layers on a conductor layer containing a conductive metal. The displacement gold plating solution contains a gold cyanide salt, a complexing agent, and a copper compound. A molar ratio of the complexing agent and the copper compound in the displacement gold plating solution is in a range of complexing agent/copper ion=1.0 to 500. A compound formed from the complexing agent and the copper compound has a stability constant of 8.5 or higher at a pH of between 4 and 6.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully