SYSTEM FOR DIGITAL DEPOSITION OF PAD / INTERCONNECTS COATINGS
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United States of America Patent
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Issued Date -
Jul 5, 2012
app pub date -
Dec 5, 2011
filing date -
Dec 27, 2010
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Abstract
A method and a system for printing patterns on an object, is provided. The system may include a copper protective coating printing unit arranged to print copper protective coating ink on the object to provide at least one copper protective coating ink pattern. The system may include zero or more additional printing units selected out of a solder mask printing unit arranged to print solder mask ink on the object to provide at least one solder mask pattern and a notation mark printing unit arranged to print notation mark ink on the object to provide at least one notation mark pattern. The system also includes at least one curing unit arranged to cure each ink printed by each printing unit.
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