ELECTRONIC PACKAGE AND METHOD OF MAKING SAME
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United States of America Patent
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Issued Date -
Jun 28, 2012
app pub date -
Oct 22, 2010
filing date -
Oct 22, 2010
priority date (Note) -
Abandoned
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Abstract
An electronic package with two circuitized substrates which sandwich an interposer therebetween, the interposer electrically interconnecting the substrates and also including an opening therein in which is positioned at least one electrical component, such as a semiconductor chip, coupled to the lower or base substrate. A second component may also be mounted on and electrically coupled to the upper surface of the top or cover circuitized substrate. A method of making such a package is also provided.
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