Local Thermal Management
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United States of America Patent
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N/A
Issued Date -
Jun 28, 2012
app pub date -
Jul 20, 2010
filing date -
Jul 20, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An apparatus and a method for thermal management of a component in a first region, wherein an interconnector connects the component thermally to a second heat region, wherein a thermally conducting heat shield encloses the interconnector from a position within the first region in close proximity to the component to the second region, and that at least one heat unit is thermally connected to the interconnector within the second region. The heat units may be heat sources and/or heat sinks, and the invention may manage the component at a higher or lower temperature than the surrounding first region. When heat enters the heat shield from a hot surrounding first region, e.g. hot gas, the heat shield conducts heat more efficiently than the medium encapsulated by the heat shield. Thus, the heat tends to follow the path provided by the heat shield. Areas of use include providing efficient particle deposition by thermophoresis or heat a component in a cold environment.
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