Use of Low-Temperature Foamable Epoxide Resins in Hollow Chamber Structures
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United States of America Patent
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app pub date -
Feb 29, 2012
filing date -
Aug 31, 2009
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Abandoned
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Abstract
A method for reinforcing a substrate having a hollow structure or for fixing an insert in such a substrate comprises introducing a one- or two-component expandable and curable preparation based on epoxy resin into a selected part of the hollow structure to be reinforced. The preparation cures by being heated to a temperature in the range from 20 to 100° C. or above, while being expanded. An epoxy resin prepolymer and an organic ammonium carbamate, which at a temperature in the range from 20° to 100° C. or above releases at least 25% of the CO2 bound as carbamate.
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