COOLING COMPONENTS OF AN ELECTRONIC UNIT
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United States of America Patent
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Issued Date -
Jun 21, 2012
app pub date -
Dec 16, 2011
filing date -
Dec 20, 2010
priority date (Note) -
Abandoned
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Abstract
A method of enabling the cooling of components of an electronic unit is provided. The method comprises providing a thermally conductive liquid or gel in contact with the components wherein the unit is an electronic module comprising a casing comprising metallic material and housing the components. The method further comprises including such liquid or gel in the casing to fill the entire space within the casing apart from the components so that heat from the components can be conducted via the liquid or gel to the casing.
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