LED LIGHTING DEVICE WITH EXCELLENT HEAT DISSIPATION PROPERTY
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United States of America Patent
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Issued Date -
Jun 21, 2012
app pub date -
Dec 17, 2010
filing date -
Dec 17, 2010
priority date (Note) -
Abandoned
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Abstract
The present invention relates to an improved LED lighting device with good heat dissipation, comprising: a housing; a copper circuit layer, disposed on the housing; a plurality of LED chips, disposed on the copper circuit layer; and a white reflective member, disposed on the plurality of LED chips and the copper circuit layer, wherein the white reflective member is used to increase the light-emitting efficiencies of the LED chips. In the present invention, the copper circuit layer is directly disposed on the housing without using an aluminum substrate or a print circuit board, so that the cost of the improved LED lighting device is reduced; moreover, that also prevents the LED chips from damage when welding the LED chips, and makes the improved LED lighting device performing better heat dissipation property.
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