PROCESS FOR FABRICATING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES
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United States of America Patent
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Issued Date -
Jun 14, 2012
app pub date -
Nov 28, 2011
filing date -
Dec 8, 2010
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Abandoned
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Abstract
A process for fabricating semiconductor devices provides a wafer of integrated circuits, permanently attaches an optical wafer to the wafer of integrated circuits, and temporarily attached a supporting wafer to the optical wafer. The supporting wafer provides structural support during further fabrication processes where a back side of the wafer of integrated circuits is thinned and through silicon vias are formed. The supporting wafer is then removed and the wafer of integrated circuits with the optical wafer is singulated into individual integrated-circuit chips.
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