Method of Avoiding Resin Outflow from the Wafer Scribe line in WLCSP
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United States of America Patent
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Issued Date -
Jun 7, 2012
app pub date -
Mar 10, 2011
filing date -
Dec 7, 2010
priority date (Note) -
Abandoned
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Abstract
A preparation process of wafer level chip scale packaging that prevents damaging a wafer in molding process is disclosed. In this process, a grinding grove is formed at a top side and around the edge of a wafer before molding is performed. The grinding groove effectively prevents the molding material from overflowing to the edge of the wafer, which avoids the damage of the wafer.
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