Method of forming resistance variable memory device

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United States of America Patent

PATENT NO 8580606
APP PUB NO 20120142141A1
SERIAL NO

13241315

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Abstract

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A method of forming a resistance variable memory device, the method including forming a diode on a semiconductor substrate; forming a lower electrode on the diode; forming a first insulating film on the lower electrode, the first insulating film having an opening; forming a resistance variable film filling the opening such that the resistance variable film includes an amorphous region adjacent to a sidewall of the opening and a crystalline region adjacent to the lower electrode; and forming an upper electrode on the resistance variable film.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD416 MAETAN-DONG YEONGTONG-GU SUWON-SI GYEONGGI-DO 442-742

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cho, Sung-Lae Gwacheon-si, KR 54 1463
Horii, Hideki Seoul, KR 56 1289
Park, Jeong-Hee Hwaseong-si, KR 39 778
Park, Jung-Hwan Seoul, KR 57 1714

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