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United States of America Patent
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Issued Date -
Jun 7, 2012
app pub date -
Sep 2, 2010
filing date -
Sep 4, 2009
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Abandoned
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Abstract
A curable prepreg comprising a structural layer of conductive fibres and a first outer layer of thermosetting resin, the resin layer comprising thermoplastic particles and glassy carbon particles provides improved electrical conductivity and excellent mechanical properties.
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