Wafer level camera module with active optical element
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United States of America Patent
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Nov 18, 2014
Issued Date -
N/A
app pub date -
Dec 28, 2011
filing date -
Jun 29, 2009
priority date (Note) -
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Abstract
A wafer level camera module can be easily connected to a host device via mounting surface contacts. The module includes an electrically controllable active optical element and a flexible printed circuit that provides electrical connection between the optical element and surface conductors on a mounting surface of the module. The surface conductors can be a group of solder balls, and the module can have another group of solder balls that make connection to another electrical component of the module, such as an image sensor. All of the solder balls can be coplanar in a predetermined grid pattern, and all of the components of the device can be surrounded by a housing such that the camera module is an easily mounted ball grid array type package.
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