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United States of America Patent
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Issued Date -
Jun 7, 2012
app pub date -
Dec 7, 2011
filing date -
Dec 7, 2010
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A tape for carrying at least a semiconductor package structure comprising a body, a carrying plate and a side wall is provided. The body has at least an opening. The carrying plate is capable of carrying the semiconductor package structure and has a plurality of containing portions. The side wall surrounds the carrying plate and connects between the body and the carrying plate. A side surface of the semiconductor package structure leans against the side wall and a plurality of solder balls disposed on a bottom surface of the semiconductor package structure are contained in the containing portion. Accordingly, the solder balls may be protected from being damaged by the carrying plate.
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