METHOD OF PRODUCING AN ELECTRICALLY CONDUCTING VIA IN A SUBSTRATE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 7, 2012
app pub date -
Aug 4, 2010
filing date -
Aug 19, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention relates to a method of producing an electrically-conducting via in a substrate and to a substrate produced thereby. The method comprises the steps: a) providing a substrate made of at least one electrically insulating material (1), b) placing said substrate between two electrodes (3, 3′), said two electrodes being connected to a user-controlled voltage source (4), c) appling a voltage to said substrate, d) causing a dielectric breakdown and energy dissipation between said two electrodes through said substrate by locally or globally increasing the electrical conductivity of said substrate, wherein, in step d), a modification of said at least one electrically insulating material into an electrically conducting material occurs, thereby generating an electrically conducting via (6). In particular, in one embodiment, the present invention relates to a substrate, such as a printed circuit board having one or several metal-free electrically conducting vias.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully